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| Customization: | Available |
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| Layers: | 1-16 Layers |
| Base Material: | Pi + Fr-4 |
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TECHNICAL PARAMETERS | |
Trademark | TDT-ELE |
Country Of Origin | China |
Packing | Anti-Static Bubble Wrap ESD-Safe Blister Tray ESD-Safe Foam Tray Partition Insert With ESD-Safe Bubble Bag |
Layer Count | 1-16 Layers |
Material | PI + FR-4 |
FPC Stack-Up | 1-Layer:PET Thickness: 36Um 2-Layer:PET Thickness: 36Um 4-Layer :Inner/Outer Layer Copper Weight: 1/3Oz, 0.5Oz, And 1Oz. Lamination Structures: With Coverlay Or Without Coverlay. For Inner Layers With 1Oz Copper Weight, Coverlay Is Applied By Default To Prevent Delamination And Blistering During Lamination |
Maximum Dimensions | Regular: 234 × 490 mm |
Minimum Dimensions | No Limit, But FPCs Whose Dimension Is Smaller Than 20 × 20 mm Are Best Panelised |
FPC Finished Thickness | 1-Layer: 0.12 mm 2-Layer: 0.19 mm Transparent FPC: 1-Layer: 0.14 mm 2-Layer: 0.24 mm |
Surface Finish | ENIG. Thickness: 1U" / 2U |
Thickness With Stiffener | Thickness With Stiffener = FPC Thickness + Stiffener Thickness |
FPC Thickness Tolerance | ±0.05 mm |
Hole Diameter | 0.15-6.5 mm |
Coverlay Color | Yellow / Black / White |
Coverlay Opening | Coverlay Expansion (One-Sided): 0.1 mm Coverlay Opening To Trace Clearance: ≥ 0.15 mm (More Whenever Possible) |
PI Stiffener | Thickness Options: 0.1 mm, 0.15 mm, 0.20 mm, 0.225 mm, 0.25 mm |
FR4 Stiffener | Thickness Options: 0.1 mm, 0.2 mm |
Certificates | IATF16949 / ISO9001:2015 / ISO13485/ QC08000 / ISO45001 / Apple MFI |








