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| Customization: | Available |
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| Metal Coating: | Gold |
| Mode of Production: | SMT/ Thru-Hole |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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| Refund policy: | Claim a refund if your order doesn't ship, is missing, or arrives with product issues. |
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TECHNICAL PARAMETERS | |
Trademark | TDT-ELE |
Country Of Origin | China |
Packing | Anti-static bubble wrap ESD-safe blister tray ESD-safe foam tray Partition insert with ESD-safe bubble bag |
Assembly Types | SMT/ Thru-hole |
PCB Layer | 1 - 32 layers |
PCB Thickness | No limit |
PCBA Order Volume | No limit |
Delivery Format | Single PCB, Panel with mouse bites, Panel with V-cut |
Layer Stackup | All stack-up |
Gold Fingers/Castellated Holes/Edge Plating | Support |
Edge Rails | Necessary |
Fiducials | Necessary |
Minimum Package | 01005 |
Minimum IC Pin Spacing | 0.3mm |
Minimum BGA Spacing | 0.3mm(center to center) |
Mounting Machine | NXT-M6III |
SPI | Yes |
AOI | Yes |
Visual Inspection | Yes |
X-ray Inspection | Yes (only for certain parts, such as BGA) |
Build time | 7-35 days |
Function test | Yes |
Conformal coating | Yes |
PCBA Potting | Yes |
Design for Manufacturability (DFM) | Yes |
Global Component Sourcing | Yes |
Final Case Assembly Services | Yes |
Cable Harnessing | Yes |
Certificates | IATF16949 / ISO9001:2015 / ISO13485/ QC08000 / ISO45001 / Apple MFI |








