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| Customization: | Available |
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| Mode of Production: | SMT & Thd |
| Layers: | 1-Layer,2-Layers,4-Layers |
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Trademark | Tdt-Ele |
Country Of Origin | China |
Packing | Anti-Static Bubble Wrap ESD-Safe Blister Tray ESD-Safe Foam Tray Partition Insert With ESD-Safe Bubble Bag |
Layer Count | 1-Layer,2-Layers,4-Layers |
FPC Stack-Up | 1-Layer:PET Thickness: 36Um 2-Layer:PET Thickness: 36Um 4-Layer :Inner/Outer Layer Copper Weight: 1/3Oz, 0.5Oz, And 1Oz. Lamination Structures: With Coverlay Or Without Coverlay. For Inner Layers With 1Oz Copper Weight, Coverlay Is Applied By Default To Prevent Delamination And Blistering During Lamination |
Maximum Dimensions | Regular: 234 × 490 Mm |
Minimum Dimensions | No Limit, But FPCs Whose Dimension Is Smaller Than 20 × 20 Mm Are Best Panelised |
FPC Finished Thickness | 1-Layer: 0.12 Mm 2-Layer: 0.19 Mm Transparent FPC: 1-Layer: 0.14 Mm 2-Layer: 0.24 Mm |
Surface Finish | ENIG. Thickness: 1U" / 2U |
Thickness With Stiffener | Thickness With Stiffener = FPC Thickness + Stiffener Thickness |
FPC Thickness Tolerance | ±0.05 Mm |
Hole Diameter | 0.15-6.5 Mm |
Coverlay Color | Yellow / Black / White |
Coverlay Opening | Coverlay Expansion (One-Sided): 0.1 Mm Coverlay Opening To Trace Clearance: ≥ 0.15 Mm (More Whenever Possible) |
PI Stiffener | Thickness Options: 0.1 Mm, 0.15 Mm, 0.20 Mm, 0.225 Mm, 0.25 Mm |
FR4 Stiffener | Thickness Options: 0.1 Mm, 0.2 Mm |








