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| Customization: | Available |
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| Mode of Production: | SMT & Thd |
| Layers: | 1-32 Layers |
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Trademark | Tdt-Ele |
Country Of Origin | China |
Packing | Anti-Static Bubble Wrap ESD-Safe Blister Tray ESD-Safe Foam Tray Partition Insert With ESD-Safe Bubble Bag |
Layer Count | 1-32 Layers |
Controlled Impedance | 4/6/8/10/12/14/16/18/20/.../32 Layers |
Impedance Tolerance | ±10% |
Material | FR-4 / Aluminum-Core /Copper-Core /RF PCB |
FR-4 Dielectric Constants | 4.5 (2-Layer PCB) |
Maximum Dimensions | FR4 PCB: 670 × 600 Mm Rogers / PTFE Teflon PCB: 590 × 438 Mm Aluminum PCB: 602 × 506 Mm Copper PCB: 480 × 286 Mm |
Minimum Dimensions | Regular: 3 × 3 Mm. Castellated / Plated Edges: 10 × 10 Mm. |
Dimension Tolerance | ±0.1Mm |
Thickness | 0.4 – 4.5 Mm |
Thickness Tolerance | ± 10% (Thickness≥1.0Mm) |
Thickness Tolerance | ± 0.1Mm (Thickness<1.0Mm) |
Finished Outer Layer Copper | 2-Layer: 1 Oz / 2 Oz / 2.5 Oz / 3.5 Oz / 4.5Oz Multi-Layer: 1 Oz / 2 Oz |
Finished Inner Layer Copper | 0.5 Oz / 1 Oz / 2 Oz |
Soldermask | Green, Purple, Red, Yellow, Blue, White ,And Black. |
Surface Finish | HASL (Leaded / Lead-Free), ENIG, OSP (Copper Core Boards Only) |








