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| Customization: | Available |
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| Mode of Production: | SMT/Thru-Hole |
| Layers: | 1 - 32layers |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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Trademark | Tdt-Ele |
Country Of Origin | China |
Packing | Anti-Static Bubble Wrap ESD-Safe Blister Tray ESD-Safe Foam Tray Partition Insert With ESD-Safe Bubble Bag |
Assembly Types | Single Sided Placement (SMT/Thru-Hole) |
PCB Layer | 1 - 32 Layers |
Thickness | No Limit |
Order Volume | No Limit |
Delivery Format | Single PCB, Panel With Mouse Bites, Panel With V-Cut |
Layer Stackup | All Stack-Up |
Gold Fingers/Castellated Holes/Edge Plating | Support |
Edge Rails | Necessary |
Fiducials | Necessary |
Minimum Package | 201 |
Minimum IC Pin Spacing | 0.35Mm |
Minimum BGA Spacing | 0.35Mm(Center To Center) |
Reflow Temperature | 240+/-5 °C |
SPI | Yes |
AOI | Yes |
Visual Inspection | Yes |
X-Ray Inspection | Yes (Only For Certain Parts, Such As BGA) |
Build Time | 7-35 Days |
Function Test | Yes |
Conformal Coating | Yes |
PCBA Potting | Yes |








